进入七月以来，国内多地接连高温
仅今年第27周，空调线上市场销售额就同比激增63%，线下更是暴增120%*
这种时候，有个成本不足整机3%的元件，却会成为出货的致命瓶颈Since July, many parts of China have experienced continuous high temperatures.
In just the 27th week of this year, online air conditioner sales surged by 63% year-on-year, and offline sales increased by a staggering 120%*
During such times, a component that costs less than 3% of the total machine becomes a fatal bottleneck in shipment

IPM模块是什么What is an IPM Module?

智能功率模块（ Intelligent Power Module ）
IPM模块将直流电转换为精确可控的三相交流电，驱动压缩机电机实现变频调速
让空调得以降低能效↓、降低噪音↓，并提升可靠性↑Intelligent Power Module (IPM)
The IPM module converts direct current into precisely controllable three-phase alternating current, driving the compressor motor to achieve variable frequency speed regulation
Enabling air conditioners to reduce energy consumption↓, reduce noise↓, and improve reliability↑

IPM的结构和要害The Structure and Critical Points of IPM

IPM为6合1封装结构，分为IGBT芯片-DBC-基板-焊料-引脚-外壳
它整合了整个压缩机需要的功率开关器件+驱动电路+保护电路
既要承受千瓦级功率的摧残，又要实现微秒级精准控制，面对的挑战可想而知IPM has a 6-in-1 package structure, consisting of IGBT chip-DBC-substrate-solder-pins-housing
It integrates all power switching devices, drive circuits, and protection circuits required by the compressor
It must withstand the destruction of kilowatt-level power while achieving microsecond-level precise control, facing challenges that can be imagined

无锡中盾科技专注工业智能在线X射线检测设备
为IPM的精密无损检测提供了解决方案Wuxi Aishield Technology specializes in industrial intelligent online X-ray inspection equipment
Providing solutions for precision non-destructive testing of IPM

WireBonding-引线键合质量检测WireBonding - Lead Bonding Quality Inspection

问题背景：Problem Background:

IPM模块内部通过金线/铜线连接芯片与引脚，若键合点存在偏移、断裂、弧度不足，会导致空调压缩机驱动失效。The IPM module connects chips to pins through gold/copper wires internally. If the bonding points have offset, breakage, or insufficient curvature, it will lead to air conditioner compressor drive failure.

解决方案：Solution:

- 多角度穿透成像：通过X射线多视角透视IPM模块，清晰呈现引线键合点的三维空间位置
- AI缺陷捕捉：AI算法自动标记键合线脱焊、弧形塌陷、交叉短路等异常- Multi-angle penetration imaging: Through X-ray multi-angle perspective of the IPM module, clearly presenting the three-dimensional spatial position of lead bonding points
- AI defect capture: AI algorithms automatically mark abnormalities such as bond wire desoldering, arc collapse, and cross short circuits

Die Bonding-芯片贴装偏移检测Die Bonding - Chip Mounting Offset Detection

问题背景：Problem Background:

功率芯片（如IGBT）与陶瓷基板间的银浆/焊料层若存在空洞或偏移，会引发散热不均，导致IPM模块过热烧毁。If there are voids or offsets in the silver paste/solder layer between power chips (such as IGBT) and ceramic substrates, it will cause uneven heat dissipation, leading to overheating and burnout of the IPM module.

解决方案：Solution:

- 分层成像技术：针对IPM的6层结构，逐层分析贴装界面。
- 数据互联：依客户实际需求接入MES、ERP、WMS等系统，实时上传检测数据。- Layered imaging technology: Targeting the 6-layer structure of IPM, analyzing mounting interfaces layer by layer.
- Data interconnection: Connecting to MES, ERP, WMS and other systems according to customers' actual needs, uploading detection data in real-time.

通过智能算法+多角度成像+产线集成三位一体，无锡中盾会成为空调IPM模块质量的守护者，从源头扼杀变频空调的驱动失效风险。Through the trinity of intelligent algorithms + multi-angle imaging + production line integration, Wuxi Aishield will become the guardian of air conditioner IPM module quality, eliminating the risk of variable frequency air conditioner drive failure from the source.